Tessera Technologies, Inc., including its Invensas and FotoNation subsidiaries, generates revenue from licensing our technologies and intellectual property toĬustomers and others who implement it for use in areas such as mobile computing and communications, memory and data storage, and 3D-IC technologies, among others. Making no adjustments to third quarter 2015 revenue or earnings per share guidance. The addition of the Ziptronix team will not change Tesseras target operating expense structure. This is a great alignment of companies that can address rapidly expanding 2.5D and 3D-IC markets. Joining the Tessera family of companies combines our efforts with a proven leader in technology development and Weve taken our technology from concept to commercialization in the backside illuminated image sensor and RF markets. Ziptronix is headquartered in Raleigh, North Carolina.ĭan Donabedian, President and CEO of Ziptronix added, There is a great opportunity to further develop these platforms with our technology partners, and were very excited about their market potential.įounded in 2000 as a venture-backed spinoff of RTI International, privately held Ziptronix is a pioneer in the development of low-temperature direct bonding ZiBond and DBI bonding are enabling technologies that provide significant cost and performance benefits, said Craig Mitchell, President of With our development expertise will help create a multi-hundred million dollar revenue opportunity for Tessera over the next decade as the industry continues to shift toward 3D-IC architectures. Im confident that aligning our respective capabilities Ziptronix has commercially licensed the ZiBond and DBI technologies and they stack up very well alongside our extensive portfolio of 2.5D and 3D intellectual property. With the escalating cost for each node of semiconductor lithography, it remains very clear to us that our R&D spend on semiconductor packaging will only become more important and valuable Portfolio, stated Tom Lacey, CEO of Tessera. With this acquisition were gaining best-in-class technology, along with exceptional people, know-how in the 3D-IC market and a significant patent Inclusive of CMOS image sensors, Tessera expects the annual market size to which this technology applies to exceed $15 billion by 2019. Ziptronixs technology is also relevant to next-generation stacked memory, 2.5D FPGAs, RF Front-End and MEMS devices, among Ziptronixs intellectual property has been licensed to SonyĬorporation for volume production of CMOS image sensors an estimated $8.3 billion market according to Gartner. Ziptronixs patented ZiBond ® direct bondingĪnd DBI ® hybrid bonding technologies deliver scalable, low total cost-of-ownership manufacturing solutions for 3D stacking. Solutions to semiconductor industry customers. The acquisition expands on Tesseras existing advanced packaging capabilities by adding a low-temperature wafer bonding technology platform that will accelerate delivery of 2.5D and 3D-IC (NASDAQ: TSRA) (Tessera or the ∼ompany) today announced theĪcquisition of Ziptronix, Inc. SAN JOSE, Calif.≺ugust 27, 2015Tessera Technologies, Inc. Ziptronix Technologies Currently Deployed in $8 Billion Image Sensor Market for $39 Millionĭeal Augments Tesseras 3D-IC Capabilities in Rapidly Growing Market
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